Film removal etching and tin removal machine

# Outer wiring & solder resistance process

support hotline

086-400-611-6535

Product Details

It is mainly used for the removal of the local corrosion resistance layer (dry film) generated by electroplating or printing of the circuit board surface, and then the surface layer is corroded to remove the unnecessary part of the copper, thus forming the line. And remove the excess tin layer on the surface of the circuit board.

Technical Parameter

Online consultation

If you are interested in our products, or if we can help you, you can call our national customer service number at any time:+86-13621559363

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Electronic, circuit industry wet process equipment

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Lead frame industry wet process equipment

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