Outer circuit & pre-weld processor grinding + Medium & Ultra roughening, grinding + sandblasting

# Outer wiring & solder resistance process

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086-400-611-6535

Product Details

It is mainly used to remove oil and oxide layer on the surface of outer plate and back plate and increase the roughness of copper surface; The dry film or solder resistance film of the next process is covered with copper surface to strengthen the bonding force.

Technical Parameter

Online consultation

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Electronic, circuit industry wet process equipment

Ceramic copper-clad plate industry wet process equipment

Lead frame industry wet process equipment

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