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086-400-611-6535It is mainly used in the development and etching process of film removal after film exposure of inner plate, soft plate and outer plate. Develop and rinse the exposed circuit board, remove the non-exposed part, and retain only the required part of the ink or film. Then the surface of the circuit board is corroded to remove the unwanted part of the copper, and finally the surface corrosion resistance layer (film) is removed to form the line.
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